Complete Wafer inspection at PVSec 2007

Tordivel AS is a complete supplier of inline and offline inspection and measurement systems and components for Wafer Production. We will present our world class systems for solar cell wafer inspection at PVSec in Milano 3-7 September 2007. Our systems are based on long experience in wafer inspection applications since 2001.

 

The scope is to check wafers, wafer blocks and ingots for defects and providing measurement and sorting data. This with the highest reliability and accuracy, low maintenance cost and the best total cost of ownership.

 

Our systems do these Wafer Measurements:

• Sawmarks

• TTV – Thickness Profile

• Size, Surface, Chipping Edge Detection

• Contamination

• Detection and Identification

• Microcrystal Detection

• 3D Wafer Block Size

• 3D Ingot Size and Shape

 

The Sawmarks Measurement System measures wafers using a patent pending and unique shadow measurement techniques, cancelling the effects of the crystal pattern. The operator can verify how the sawmarks develop over the wafer. Large sawmarks will often have a large gradient towards the edge of the wafer.

 

Presented for the first-time at PVSec is a combined Sawmarks and TTV Measurement System with a resolution of 1 micrometer.

 

Tordivel AS will also present a new solid state 3D Wafer Block Measurement System at PVSec. The system is based on accurate 3D laser profile measurements and is used to automating Wafer Block Measurements with high accuracy and reliability.

 

Another product, the Scorpion 3D Scanner, makes accurate 3D models of wafer blocks and Ingots, measuring the size and detecting defects with a resolution down to 0.01 mm. The 3D Models can be exported to CAD systems for further manipulation.

 

The solutions are built on Scorpion Vision Software for user friendliness, configurability, reliability, flexibility and ease of maintenance. Off-the-shelf world class hardware components including area- and line-scan camera technology are used.

 

Press release, 122 kByte pdf.